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TPS73233DBVT 数据表(PDF) 27 Page - Texas Instruments |
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TPS73233DBVT 数据表(HTML) 27 Page - Texas Instruments |
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27 / 47 page ![]() 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 Evaluation Modules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS732. Request the TPS73201DRBEVM-518 evaluation module (and related user guide) at the Texas Instruments website through the product folders or purchased directly from the TI eStore. 8.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS732 is available through the product folders under Simulation Models. 8.1.2 Device Nomenclature Table 8-1. Device Nomenclature PRODUCT(1) DESCRIPTION TPS732xxyyyz(M3) xx is the nominal output voltage (for example, 25 = 2.5V; 01 = Adjustable). yyy is the package designator. z is the tape and reel quantity (R = 3000, T = 250). M3 is a suffix designator for devices that only use the latest manufacturing flow (CSO: RFB). Devices without this suffix ship with the legacy silicon (CSO: DLN) or the new silicon (CSO: RFB). The reel packaging label provides CSO information to distinguish which silicon is being used. Device performance for new and legacy silicon is denoted throughout the document. (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 8.2 Documentation Support 8.2.1 Related Documentation • Texas Instruments, Regulating VOUT Below 1.2V Using an External Reference application note • Texas Instruments, TPS73x01DRBEVM-518 User's Guide 8.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 8.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 8.5 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 8.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. www.ti.com TPS732 SBVS037S – AUGUST 2003 – REVISED APRIL 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: TPS732 |
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