AM261...ZEJ datasheet(98/218 Pages) TI2

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6.10.1 ZCZ Package Thermal Characteristics

It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.

PARAMETER

DESCRIPTION

℃/W(1) (2)

AIR FLOW (m/s)

(3)

RΘJC

Junction-to-case

6.5

N/A

RΘJB

Junction-to-board

6.6

N/A

RΘJA

Junction-to-free air

19.9

RΘJA

Junction-to-moving air

13.7

12.5

11.9

ΨJT

Junction-to-package top

0.13

0.38

0.52

0.61

ΨJB

Junction-to-board

6.5

6.0

5.9

5.8

(1)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Packages

(2)

℃/W = degrees Celsius per watt

(3)

m/s = meters per second

AM2612, AM2611, AM2611-Q1, AM2612-Q1

SPRSPA7C – SEPTEMBER 2024 – REVISED JULY 2025

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