FN6406 Rev 1.00

Page 11 of 13

Sep 28, 2018

ISL59910, ISL59913

JA required for long term reliable operation can be calculated

using Equation 3:

where

•TJ is the maximum junction temperature (+150°C)

•TA is the maximum ambient temperature (+85°C)

For a QFN 28 package in a properly laid out PCB heatsinking

copper area, +37°C/W

JA thermal resistance can be

achieved. To disperse the heat, the bottom heatspreader must

be soldered to the PCB. Heat flows through the heatspreader

to the circuit board copper, then spreads and converts to air.

Thus the PCB copper plane becomes the heatsink. This has

proven to be a very effective technique.



JA

TJ TA

–



PD

------------------------

=

50.4CW

=

(EQ. 3)

Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.

Please visit our website to make sure you have the latest revision.

DATE

REVISION

CHANGE

Sep 28, 2018

FN6406.1

Added Related Literature section.

Moved Pinouts after Ordering Information table.

Updated Ordering Information table by updating brand for ISL59913 parts, adding Notes 1 and 3,

adding Evaluation boards, updating POD number, and updating tape and reel column.

Added Revision History.

Updated disclaimer and moved to end of document.

Updated POD from MDP0046 to L28.4x5.