TDA7541 datasheet(74/76 Pages) STMICROELECTRONICS

74 / 76 page

Package information

TDA7541

74/76

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 16.

LQFP64 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

TQFP64

Seating Plane

0.08mm

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.17

0.22

0.27

0.20

0.0066 0.0086 0.0106

0.0079

0.09

0.0035

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

7.50

0.295

0.50

0.0197

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

7.50

0.295

0.45

0.60

0.75

0.0177 0.0236 0.0295

1.00

0.0393

0˚ (min.), 3.5˚ (min.), 7˚(max.)

ccc

0.080

0.0031

LQFP64 (10 x 10 x 1.4mm)

0051434 F

ccc

TDA7541 数据表(PDF) 74 Page - STMicroelectronics

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