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db05175e_V3.01_preliminary_2017-07-06

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AS89000

V3.01

5.3 Soldering Information

The solder reflow profile should fulfil the specifications for the reflow profile parameters given in Table 8.

These parameters follow the IPC/JEDEC standard J-STD-020D.1. The temperature should be measure at

the top of the package.

Figure 4: Recommended reflow profile

Table 8: Reflow profile parameters

PROFILE PARAMETER

ASSEMBLY, CONVECTION

ramp-up rate (Tsmax to Tp)

2-3°C/second

preheat temperature (Tsmin to Tsmax)

150°C to 200°C

preheat time (ts)

60 – 120 seconds

time above TL, 217°C (tL)

60 – 150 seconds

peak temperature (Tp)

260°C

time within 5°C of peak temperature (tp)

20 – 40 seconds

ramp-down rate

6°C/second

time 25°C to peak temperature

8 minutes max.