CMV2000 datasheet(83/87 Pages) AMSOSRAM

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CMV2000

Soldering & storage information

Datasheet

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DS000734

• v8-00 • 2025-Jul-07

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Soldering & storage information

CMV2000 is shipped in a moisture barrier package. We recommend to keep the moisture

barrier package closed and stored under the conditions shown in Table 5. Only open the

moisture barrier package before the usage of the devices.

When reflow soldering, a dry bake needs to be performed upfront! For soldering information,

follow Standard J-STD-020. If the temperature/time profile exceeds these recommendations,

damage to the image sensor can occur.

11.1

Manual soldering

Use partial heating method and use a soldering iron with temperature control. The soldering

iron tip temperature is not to exceed 350 ºC with 270 °C maximum pin temperature, 2 seconds

maximum duration per pin. Avoid global heating of the ceramic package during soldering.

Failure to do so may alter device performance and reliability.

11.2

Wave soldering

Wave soldering is possible but not recommended. Solder dipping can cause damage to the

glass and harm the imaging capability of the device. See Figure 63 for the wave soldering

profile.

CMV2000 数据表(PDF) 83 Page - ams-OSRAM AG