TDA7571

Package information

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 6.

HiQUAD-64 mechanical data and package dimensions

HiQUAD-64

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

3.15

0.124

A1

0

0.25

0

0.010

A2

2.50

2.90

0.10

0.114

A3

0

0.10

0

0.004

b

0.22

0.38

0.008

0.015

c

0.23

0.32

0.009

0.012

D

17.00

17.40

0.669

0.685

D1 (1)

13.90

14.00

14.10

0.547

0.551

0.555

D2

2.65

2.80

2.95

0.104

0.110

0.116

E

17.00

17.40

0.669

0.685

E1 (1)

13.90

14.00

14.10

0.547

0.551

0.555

e

0.65

0.025

E2

2.35

2.65

0.092

0.104

E3

9.30

9.50

9.70

0.366

0.374

0.382

E4

13.30

13.50

13.70

0.523

0.531

0.539

F

0.10

0.004

G

0.12

0.005

L

0.80

1.10

0.031

0.043

N10

°(max.)

S

0°(min.), 7˚(max.)

(1): "D1" and "E1" do not include mold flash or protusions

- Mold flash or protusions shall not exceed 0.15mm(0.006inch) per side

c

A

A2

POQU64ME

E4 (slug lenght)

1

64

E1

Gauge Plane

0.35

L

slug

(bottom side)

COPLANARITY

G

e

b

A

N

AB

M

E3

21

33

53

B

E2

D1

D

E

BOTTOM VIEW

C

A3

C

SEATING PLANE

S

A1

E3

OUTLINE AND

MECHANICAL DATA