CHA2091

36-40GHz Low Noise Amplifier

Ref. DSCHA20917150 - 30 May 07.

6/8

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Typical Chip Assembly

- Nominal Input and Output bonding :0.3nH for one 25um bond wire.

- Chip backside is DC and RF bonding grounded

Mechanical data

Pad size : 80/80um, chip thickness 100um