5/13

PD57070 - PD57070S

TEST CIRCUIT SCHEMATIC

TEST CIRCUIT COMPONENT PART LIST

COMPONENT

DESCRIPTION

L1,L2

INDUCTOR, 5 TURNS AIR WOUND #22AWG, ID 0.059{1.49}, NYLON COATED

MAGNET WIRE

FB1,FB2

SHIELD BEAD SURFACE MOUNT EMI

R1

18 k

Ω, 1 W SURFACE MOUNT CHIP RESISTOR

R2

4.7 M

Ω, 1 W SURFACE MOUNT CHIP RESISTOR

R3

120

Ω, 2 W SURFACE MOUNT CHIP RESISTOR

C1,C2

3 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C3,C10,C11,C15

47 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C4,C9

0.8-8.0 pF GIGA TRIM VARIABLE CAPACITOR

C5,C6,C7,C8

7.5 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C12

1000 pF ATC 700B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C13,C17

0.1

µF, 500 V SURFACE MOUNT CERAMIC CHIP CAPACITOR

C14

10

µF, 50 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR

C16

100 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C18

220

µF, 63 V ALUMINUM ELECTROLYTIC RADIAL LEAD CAPACITOR

BOARD

ROGER, ULTRA LAM 2000, THK 0.030”,

+

G

V

RF

IN

RF

OUT

+

+

D

G

+

NOTES

1. DIMENSIONS AT COMPONENT SYMBOLS ARE REFERENCE FOR COMPONENT PLACEMENT.

2. GAP BETWEEN GROUND & TRANSMISSION LINE = 0.056 [1.42]

TYP.

3. DIMENSIONS OF INPUT AND OUTPUT COMPONENT FROM EDGE OF TRANSMISSION LINES.

+0.002 [0.05]

- 0.000 [0.00]

DIM

IN

MM

A

0.076

1.93

B

0.925

23.50

C

0.116

2.95

D

0.570

14.48

E

0.100

2.54

F

0.609

15.47

G

0.544

13.82

H

0.667

16.94

J

0.616

15.65

K

0.316

18.03

L

0.396

10.06

M

0.120

3.05

N

1.610

40.89

P

0.076

1.93

R

0.925

23.50

S

0.076

1.93

DIMENSION TABLE