HMC788A-EP

Enhanced Product

Rev. B | Page 4 of 8

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VCC

7 V

RFIN (VCC = 5 V)

20 dBm

Continuous Power Dissipation, PDISS1

TCASE = 85°C

0.76 W

TCASE = 105°C

0.59 W

Junction (TJ) Temperature

175°C

Operating (TOPR) Temperature Range

−55°C to +105°C

Storage Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity,

Human Body Model (HBM)

Class 1A

1

For maximum power dissipation vs. case temperature, see Figure 2.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJC is the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC

Unit

CP-6-101

118.0

°C/W

1

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board with nine thermal vias. See JEDEC JESD51.

POWER DERATING CURVES

Figure 2 shows the maximum power dissipation vs. case

temperature.

CASE TEMPERATURE (°C)

0

0.125

0.250

0.375

0.500

0.625

0.750

0.875

1.000

–60

–40

–20

0

20

40

60

80

100

120

Figure 2. Maximum Power Dissipation vs. Case Temperature

ESD CAUTION