12 (15)

DA9180.004

15 September, 2005

SOLDERING INFORMATION

N

For Eutectic Sn/Pb TSSOP-16

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20 2*220

°C

Maximum Temperature

240

°C

Maximum Number of Reflow Cycles

2

Reflow profile

Thermal profile parameters stated in JESD22-A113 should not

Seating Plane Co-planarity

max 0.08 mm

Lead Finish

Solder plate 7.62 - 25.4

µm, material Sn 85% Pb 15%

N

For Pb-Free, RoHS Compliant TSSOP-16

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20

Maximum Temperature

260

°C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in IPC/JEDEC J-STD-020

Seating Plane Co-planarity

max 0.08 mm

Lead Finish

Solder plate 7.62 - 25.4 µm, material Matte Tin