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M95010-RBN6TG/W 数据表(PDF) 20 Page - STMicroelectronics |
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M95010-RBN6TG/W 数据表(HTML) 20 Page - STMicroelectronics |
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20 / 37 page ![]() M95040, M95020, M95010 20/37 MAXIMUM RATING Stressing the device outside the ratings listed in Table 7. may cause permanent damage to the de- vice. These are stress ratings only, and operation of the device at these, or any other conditions out- side those indicated in the Operating sections of this specification, is not implied. Exposure to Ab- solute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 7. Absolute Maximum Ratings Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU. 2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500 Ω, R2=500Ω) Symbol Parameter Min. Max. Unit TSTG Storage Temperature –65 150 °C TLEAD Lead Temperature during Soldering 1 See note 1 °C VO Output Voltage –0.50 VCC+0.6 V VI Input Voltage –0.50 6.5 V VCC Supply Voltage –0.50 6.5 V VESD Electrostatic Discharge Voltage (Human Body model) 2 –4000 4000 V |
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