AD8506/AD8508

Rev. A | Page 17 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-AA

0.80

0.60

0.40

8°

0°

4

8

1

5

PIN 1

0.65 BSC

SEATING

PLANE

0.38

0.22

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.08

3.20

3.00

2.80

5.15

4.90

4.65

0.15

0.00

0.95

0.85

0.75

Figure 47. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

Figure 48. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8506ARMZ-R21

–40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A1X

AD8506ARMZ-REEL1

–40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

A1X

AD8508ARUZ1

–40°C to +125°C

14-Lead Thin Shrink Small Outline Package [TSSOP]

RU-14

AD8508ARUZ-REEL1

–40°C to +125°C

14-Lead Thin Shrink Small Outline Package [TSSOP]

RU-14