Package information

STTH3R04

6/10

Figure 17.

Thermal resistance junction to ambient versus copper surface under

each lead, SMB, SMC (epoxy FR4, copper thickness = 35 µm)

2

Package information

●

Epoxy meets UL94, V0

●

Cooling method: by conduction (C)

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

0

20

40

60

80

100

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

SMB

SMC

Table 6.

DO201AD dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

9.50

0.374

B

25.40

1.000

C

5.30

0.209

D

1.30

0.051

E

1.25

0.049

Notes

1 - The lead diameter ø D is not

controlled over zone E

2 - The minimum length which must stay

straight between the right angles after

bending is 0.59"(15mm)

ØC

ØD

A

EE

Note 2

Note 1

Note 1

BB