Application information

TS982

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3

Application information

3.1

Exposed-pad package description

The dual operational amplifier TS982 is housed in an SO-8 exposed-pad plastic package.

As shown in Figure 40, the die is mounted and glued on a lead frame. This lead frame is

exposed as a thermal pad on the underside of the package. The thermal contact is direct

with the die and therefore, offers an excellent thermal performance in comparison with the

common SO packages. The thermal contact between the die and the exposed-pad is

Figure 40.

Exposed-pad plastic package

As 90% of the heat is removed through the pad, the thermal dissipation of the circuit is

the copper area and the number of layers of the printed circuit board under the pad.

Figure 41.

3.2

Exposed-pad electrical connection

In the SO-8 exposed-pad package, the silicon die is mounted on the thermal pad (see

Figure 40). The silicon substrate is not directly connected to the pad because of the glue.

Therefore, the copper area of the exposed-pad must be connected to the substrate voltage