TS982

Application information

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3.3

Thermal management benefits

A good thermal design is important to maintain the temperature of the silicon junction below

power level.

Another effect of temperature is that the life expectancy of an integrated circuit decreases

exponentially when operating at high temperature over an extended period of time. It is

estimated that, the chip failure rate doubles for every 10° to 20° C. This demonstrates that

reducing the junction temperature is also important to improve the reliability of the amplifier.

Because of the high dissipation capability of the SO-8 exposed-pad package, the dual op-

amp TS982 has a lower junction temperature for high current applications in high ambient

temperatures.

3.4

Thermal management guidelines

The following guidelines are a simple procedure to determine the PCB you should use in

order to get the best from the SO-8 exposed-pad package:

1.

The other terms are the power dissipated by the two operators to source the load. If the

output signal can be assimilated to a DC signal, you can calculate the dissipated power

using the voltage drop curves versus output current, supply voltage, and temperature

(Figure 2 on page 7 to Figure 8 on page 8).

2.

3.

considerations.

SO-8 exposed pad versus the copper area of a top side PCB.