Package mechanical data

VT5376

28/30

Note:

1

Surface finish W1 is 0.07 Ra.

2

Ejectors are on 5.2 mm square for both top and bottom package.

3

On top package, only the pin 1 identification is not an engraved ejector.

10.1

TQFP package guidelines

The IC can be exposed a maximum of two times to an IR/Convection reflow solder process

having a temperature profile peak of no higher than 240

° C.

The package/chip are lead free and is ROHS compliant.

For full handling guidelines please contact ST (document reference 7310263).

Table 10.

TQFP dimensions (mm)

Reference

Minimum (mm)

Typical (mm)

Maximum (mm)

A

1.600

A1

0.050

0.150

A2

1.350

1.400

1.450

B

0.300

0.370

0.450

c

0.090

0.200

D9.000

D1

7.000

D3

5.600

e0.800

E9.000

E1

7.000

E3

5.600

L

0.450

0.600

0.750

L1

1.000

k0d

3.5d

7d

W1

5.000

W2

0.650