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EMIF03-SIM02C2 数据表(PDF) 6 Page - STMicroelectronics |
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EMIF03-SIM02C2 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Package information EMIF03-SIM02C2 6/8 3 Package information ● Epoxy meets UL94, V0 Figure 11. Flip-Chip Dimensions Figure 12. Marking Figure 13. Footprint recommendation 1.42mm ± 50µm 315µm ± 50 500µm ± 50 695µm ± 65 x y x w z w E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter |
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