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EMIF03-SIM02C2 数据表(PDF) 7 Page - STMicroelectronics |
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EMIF03-SIM02C2 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 8 page ![]() EMIF03-SIM02C2 Ordering information 7/8 Figure 14. Flip-Chip tape and reel specification In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information 5 Revision history Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 +/- 0.1 4 +/- 0.1 Ø 1.5 +/- 0.1 0.78 +/- 0.05 Ordering code Marking Package Weight Base qty Delivery mode EMIF03-SIM02C2 GJ Flip-Chip 3.04 mg 5000 7” Tape and reel Date Revision Changes 07-Feb-2007 1 Initial release. 21-Mar-2007 2 Updated weight in Ordering information. |
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