Ordering information

EMIF10-COM01C2

6/7

Figure 13.

Flip-Chip tape and reel specification

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

Note:

More informations are available in the application notes:

AN1235: “Flip-Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

4

Ordering information

5

Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

EMIF10-COM01C2

FE

Flip-Chip

8.3 mg

5000

Tape and reel

Date

Revision

Description of Changes

12-Jul-2005

1

First issue.

12-Aug-2005

2

Lead free added in Benefits on page 1. ECOPACK

statement added on page 6.

27-Jan-2006

3

Improved graphics to show coating. Updated attenuation

measurement graphic (Figure 3). Weight corrected.

04-Apr-2006

4

Reformatted to current standard. Pin identification in

Figure 1 updated.