EMIF10-COM01C2 datasheet(5/7 Pages) STMICROELECTRONICS

部件名	EMIF10-COM01C2

功能描述	EMI Filter including ESD protection

PDF	7 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

5 / 7 page

EMIF10-COM01C2

Ordering Information Scheme

5/7

Ordering Information Scheme

Package information

Figure 10.

Flip-Chip package dimensions

EMIF

xxx zz

EMI Filter

Number of lines

Information

Package

x = resistance value (Ohms)

z = capacitance value / 10(pF)

3 letters = application

2 digits = version

C = coated flip-chip

x = 1: 500µm, Bump = 315µm

= 2: Leadfree Pitch = 500µm, Bump = 315µm

Figure 11.

Foot print recommendations

Figure 12.

Marking

2.42 mm ± 50 µm

315 µm ± 50

500 µm ± 50

695 µm ± 70

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

EMIF10-COM01C2 数据表(PDF) 5 Page - STMicroelectronics

EMIF10-COM01C2 数据表(HTML) 5 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7

数据表下载