Package information

TS4990

24/32

5

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

5.1

Flip-chip package information

Figure 65.

Flip chip pinout (top view)

Figure 66.

Marking (top view)

A

C

B

1

2

3

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY

A

C

B

1

2

3

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY

■

Balls are underneath

XXX

YWW

E

XXX

YWW

E

A90 from Tours

90S from Shenzhen

Symbol for

lead-free package