Package information

TS4990

28/32

5.3

DFN8 package information

Note:

DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal

performance, the exposed pad must be soldered to a copper area on the PCB, acting as a

heatsink. This copper area can be electrically connected to pin7 or left floating.

Figure 72.

DFN8 3x3x0.90mm package mechanical drawing (pitch 0.5mm)

Table 9.

DFN8 3x3x0.90mm package mechanical data (pitch 0.5mm)

Ref.

Dimensions

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.80

0.90

1.00

31.5

35.4

39.4

A1

0.02

0.05

0.8

2.0

A2

0.55

0.65

0.80

217

25.6

31.5

A3

0.20

7.9

b

0.18

0.25

0.30

7.1

9.8

11.8

D

2.85

3.00

3.15

112.2

118.1

124

D2

2.20

2.70

86.6

106.3

E

2.85

3.00

3.15

112.2

118.1

124

E2

1.40

1.75

55.1

68.9

e

0.50

19.7

L

0.30

0.40

0.50

11.8

15.7

19.7

ddd

0.08

3.1