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STP22NM50FP 数据表(PDF) 3 Page - STMicroelectronics |
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STP22NM50FP 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 10 page ![]() 3/10 STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1 ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) Turn-on Delay Time VDD =250 V, ID =10 A RG = 4.7Ω VGS =10 V (see test circuit, Figure 3) 24 ns tr Rise Time 16 ns Qg Total Gate Charge VDD =400 V, ID =20 A, VGS =10 V 40 56 nC Qgs Gate-Source Charge 13 nC Qgd Gate-Drain Charge 19 nC Symbol Parameter Test Conditions Min. Typ. Max. Unit tr(Voff) Off-voltage Rise Time VDD = 400 V, ID =20A, RG =4.7Ω, VGS =10 V (see test circuit, Figure 5) 9ns tf Fall Time 8.5 ns tc Cross-over Time 23 ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 20 A ISDM (2) Source-drain Current (pulsed) 80 A VSD (1) Forward On Voltage ISD =20A,VGS =0 1.5 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 20 A, di/dt = 100A/µs, VDD =100 V, Tj =25°C (see test circuit, Figure 5) 350 4.6 26 ns µC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 20 A, di/dt = 100A/µs, VDD =100 V, Tj =150°C (see test circuit, Figure 5) 435 5.9 27 ns µC A |
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