Package mechanical data

TS472

20/24

6

Package mechanical data

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

6.1

Flip-chip package

Figure 43.

TS472 footprint recommendation

Figure 44.

Pin-out (top view)

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

A

C

B

1

2

3

D

IN+

IN-

GND

OUT+

C2

C1

OUTPUT

BIAS

GS

VCC

OUT-

STDBY

BYPASS

A

C

B

1

2

3

D

IN+

IN-

GND

OUT+

C2

C1

OUTPUT

BIAS

GS

VCC

OUT-

STDBY

STDBY

BYPASS

Balls are underneath