ADA4857-1/ADA4857-2

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 4

Common-Mode Input Voltage

Differential Input Voltage

Exposed Paddle Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for device soldered in circuit board for surface-mount packages.

Table 4.

Package Type

Unit

8-Lead SOIC

115

15

°C/W

8-Lead LFCSP

94.5

34.8

°C/W

16-Lead LFSCP

68.2

19

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4857 is

the die. At approximately 150°C, which is the glass transition

temperature, the properties of the plastic change. Even temporarily

exceeding this temperature limit may change the stresses that

the package exerts on the die, permanently shifting the parametric

performance of the ADA4857. Exceeding a junction temperature of

175°C for an extended period can result in changes in silicon

devices, potentially causing degradation or loss of functionality.

quiescent power dissipation and the power dissipated in the

die due to the ADA4857 drive at the output. The quiescent

()

L

OUT

L

OUT

S

S

S

D

R

V

R

V

V

I

V

P

2

–

2

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

×

+

×

=

() (

)

L

S

S

S

D

R

V

I

V

P

2

4

/

+

×

=

In addition, more metal directly in contact with the package

leads and exposed paddle from metal traces, through holes,

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the SOIC and LFCSP

values are approximations.

0

0.5

1.0

1.5

2.0

2.5

3.0

–40 –30 –20 –10 0 102030405060708090 100 110 120

AMBIENT TEMPERATURE (°C)

ADA4857-1 (SOIC)

ADA4857-1 (LFCSP)

ADA4857-2 (LFCSP)

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION