STPC0366BTI3 datasheet(40/51 Pages) STMICROELECTRONICS

部件名	STPC0366BTI3

功能描述	PC Compatible Embeded Microprocessor

PDF	51 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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MECHANICAL DATA

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Issue 1.2

5.2 388-Pin Package thermal data

388-pin PBGA package has a Power Dissipation

Capability of 4.5W which increases to 6W when

used with a Heatsink.

Structure in shown in Figure 5-4.

Thermal dissipation options are illustrated in Fig-

ure 5-5 and Figure 5-6.

Figure 5-4. 388-Pin PBGA structure

Thermal balls

Power & Ground layers

Signal layers

Figure 5-5. Thermal dissipation without heatsink

Ambient

Board

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

125

8.5

Rja = 13

°C/W

Airflow = 0

Board dimensions:

The PBGA is centered on board

Copper thickness:

-17

µm for internal layers

-34

µm for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Board temperature taken at the center balls

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