STPC0375BTI3 datasheet(45/51 Pages) STMICROELECTRONICS

部件名	STPC0375BTI3

功能描述	PC Compatible Embeded Microprocessor

PDF	51 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

45 / 51 page

BOARD LAYOUT

45/51

Issue 1.2

The PBGA Package also dissipates heat through

peripheral ground balls. When a heat sink is

placed on the device, heat is more uniformely

spread throughout the moulding increasing heat

dissipation through the peripheral ground balls.

The more via pads are connected to each ground

ball, the more heat is dissipated . The only limita-

tion is the risk of lossing routing channels.

Figure 6-5 shows a routing with a good trade off

between thermal dissipation and number of rout-

ing channels.

Figure 6-4. Optimum layout for central ground ball

Via to Ground layer

Pad for ground ball

Clearance = 6mil

diameter = 25 mil

hole diameter = 14 mil

Solder mask

diameter = 33 mil

External diameter = 37 mil

connections = 10 mil

Figure 6-5. Global ground layout for good thermal dissipation

Ground pad

Via to ground layer

STPC0375BTI3 数据表(PDF) 45 Page - STMicroelectronics