1.0E-3

1.0E-2

1.0E-1

1.0E+0

0

1

2

3

4

5

6

7

8

t(s)

IM(A)

Ta=50

°C

Ta=75

°C

Ta=100

°C

t

δ=0.5

Fig. 3-1: Non repetitive surge peak forward current

versus overload duration (maximum values) (SMB).

0

5

10

15

20

25

30

1E-1

1E+0

1E+1

1E+2

1E+3

5E+3

VR(V)

IR(

µA)

Tj=125

°C

Tj=70

°C

Tj=25

°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

1.0E-2

1.0E-1

1.0E+0

1.0E+1

1.0E+2

1.0E+3

0.0

0.2

0.4

0.6

0.8

1.0

Zth(j-a)/Rth(j-a)

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

tp(s)

T

tp

Fig. 4-1: Relative variation of thermal impedan ce

junction to ambient versus pulse duration (epoxy

printed circuit board, S(Cu)=35mm, recommended

pad layout). ( SM B)

12

5

10

20

30

10

20

50

100

200

500

VR(V)

C(pF)

F=1MHz

Tj=25

°C

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

1.0E-3

1.0E-2

1.0E-1

1.0E+0

0

1

2

3

4

5

6

7

8

t(s)

IM(A)

Ta=50

°C

Ta=75

°C

Ta=100

°C

t

δ=0.5

Fig. 3-2: Non repetitive surge peak forward current

versus overload duration (maximum values) (SMA).

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

0.0

0.2

0.4

0.6

0.8

1.0

tp(s)

Zth(j-a)/Rth(j-a)

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

T

tp

Fig. 4-2: Relative variation of thermal impedance

junction to ambient versus pulse duration (epoxy

printed circuit board, S(Cu)=35mm, recommended

pad layout).( SMA )

STPS130A/U

3/6