0.0

0.2

0.4

0.6

0.8

1.0

1.2

0.01

0.10

1.00

10.00

VFM(V)

IFM(A)

Tj=25

°C

Tj=75

°C

Tj=125

°C

Fig. 7: Forward voltage drop versus forward cur-

rent (maximum values).

012345

0

20

40

60

80

100

120

S(Cu) (cm )

Rth(j-a) (

°C/W)

P=1.5W

Fig. 8-1: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed

circuit

board,

copper

thickness:

35

µm).(SMB)

012345

0

20

40

60

80

100

120

140

S(Cu) (cm )

Rth(j-a) (

°C/W)

P=1.5W

Fig. 8-2: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed

circuit

board,

copper

thickness:

35

µm).(SMA)

STPS130A/U

4/6