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L6599 数据表(PDF) 33 Page - STMicroelectronics |
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L6599 数据表(HTML) 33 Page - STMicroelectronics |
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33 / 36 page ![]() L6599 Package mechanical data 33/36 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. Plastic DIP-16 mechanical data Dim. mm. inch Min Typ Max Min Typ Max a1 0.51 0.020 B 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 Figure 35. Plastic DIP-16 package dimensions |
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