STPS3L60/Q/U

4/6

1

10

0.0

0.5

1.0

1.5

2.0

2.5

30

I

(A)

FM

V

(V)

FM

T =25°C

j

T =100°C

(maximum values)

j

T =100°C

(typical values)

j

Fig. 9-1: Forward voltage drop versus forward

current (high level, maximum values).

0

1

2

3

4

5

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

I

(A)

FM

V

(V)

FM

T =25°C

j

T =100°C

(maximum values)

j

T =100°C

(typical values)

j

Fig. 9-2: Forward voltage drop versus forward

current (low level, maximum values).

1

10

100

10

20

50

100

200

500

C(pF)

V (V)

R

F=1MHz

T =25°C

j

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0

20

40

60

80

100

120

R

(°C/W)

th(j-)

S(Cu)(cm²)

Fig. 10: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, Cu: 35µm) (SMB).

0

5

10

15

20

25

30

35

40

45

50

55

60

1E-3

1E-2

1E-1

1E+0

1E+1

5E+1

I (mA)

R

V (V)

R

T =125°C

j

T =100°C

j

T =25°C

j

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

T

tp

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

Z/R

th(j-a)

th(j-a)

t (s)

p

Fig. 6-2: Relative variation of thermal impedance

junction to ambient versus pulse duration (DO-15).