0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.1

1.0

10.0

IFM(A)

Tj=125

°C

Typical values

Tj=150

°C

VFM(V)

Fig. 7: Forward voltagedrop versus forwardcurrent

(maximum values, per diode).

0

4

8

12

16

20

24

28

32

36

40

0

10

20

30

40

50

60

70

80

S(Cu) (cm )

Rth(j-a) (

°C/W)

Fig. 8: Thermal resistance junction to ambient versus

copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

µm).

PACKAGE MECHANICAL DATA

TO-220AB

A

C

D

L7

Dia

L5

L6

L9

L4

F

H2

G

G1

L2

F2

F1

E

M

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.40

4.60

0.173

0.181

C

1.23

1.32

0.048

0.051

D

2.40

2.72

0.094

0.107

E

0.49

0.70

0.019

0.027

F

0.61

0.88

0.024

0.034

F1

1.14

1.70

0.044

0.066

F2

1.14

1.70

0.044

0.066

G

4.95

5.15

0.194

0.202

G1

2.40

2.70

0.094

0.106

H2

10

10.40

0.393

0.409

L2

16.4 typ.

0.645 typ.

L4

13

14

0.511

0.551

L5

2.65

2.95

0.104

0.116

L6

15.25

15.75

0.600

0.620

L7

6.20

6.60

0.244

0.259

L9

3.50

3.93

0.137

0.154

M

2.6 typ.

0.102 typ.

Diam.

3.75

3.85

0.147

0.151

STPS640CT/CF/CB

4/6