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STT4NF30L 数据表(PDF) 2 Page - STMicroelectronics |
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STT4NF30L 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 5 page ![]() THERMAL DATA Rthj-amb TJ Tstg (*)Thermal Resist ance Junction-ambient Max Maximum O perat ing Junction Temperature Storage T emperature 62.5 150 -55 to 150 oC/W oC oC (*) Mounted on FR-4 board (t ≤ 5 sec) ELECTRICAL CHARACTERISTICS (Tcase =25 oC unless otherwise specified) OFF Symbo l Parameter Test Con ditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID =250 µAVGS =0 30 V IDSS Zero Gat e Voltage Drain Current (VGS =0) VDS =Max Rating VDS =Max Rating Tc = 125 oC 1 10 µA µA IGSS Gat e-body Leakage Current (VDS =0) VGS = ± 20 V ± 100 nA ON ( ∗) Symbo l Parameter Test Con ditions Min. Typ. Max. Unit VGS(th) Gat e Threshold Voltage VDS =VGS ID = 250 µA1 1.7 2. 5 V RDS(on) Static Drain-source On Resistance VGS =10V ID =2 A VGS =4.5V ID =2 A 0.055 0.06 0.065 0.09 Ω Ω ID(o n) On State Drain Current VDS >ID(o n) xRDS(on )max VGS =10 V 4A DYNAMIC Symbo l Parameter Test Con ditions Min. Typ. Max. Unit gfs ( ∗)Forward Transconductance VDS >ID(o n) xRDS(on )max ID =6 A 6 S Ciss Coss Crss Input Capacitance Out put Capacitance Reverse Transfer Capacitance VDS = 25V f = 1MHz VGS = 0 420 62 20 550 80 30 pF pF pF STT4NF30L 2/5 |
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