STTH302

3/5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

IF(av)(A)

T

tp

PF(av)(W)

δ = 0.05

δ = 0.1

δ = 0.2

δ = 0.5

δ = 1

Fig. 1: Average forward power dissipation versus

average forward current.

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0

25

50

75

100

125

150

175

Tamb(°C)

Rth(j-a)=Rth(j-l)

Rth(j-a)=75°C/W

IF(av)(A)

Fig. 2: Average forward current versus ambient

temperature (

δ=0.5).

0

10

20

30

40

50

60

70

80

90

5

10152025

Lleads(mm)

Rth(j-a)

Rth(j-l)

Rth(°C/W)

Fig. 3: Thermal resistance versus lead length.

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

tp(s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

T

tp

Zth(j-a)/Rth(j-a)

Fig. 4: Relative variation of thermal impedance

junction ambient versus pulse duration (printed

circuit board epoxy FR4, LIeads = 10mm).

10

100

1

10

100

1000

VR(V)

F=1MHz

Vosc=30mV

Tj=25°C

C(pF)

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VFM(V)

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

IFM(A)

Fig. 5: Forward voltage drop versus forward

current.