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STV0042A 数据表(PDF) 15 Page - STMicroelectronics |
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STV0042A 数据表(HTML) 15 Page - STMicroelectronics |
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15 / 24 page ![]() PIN INTERNAL CIRCUITRY (continued) A GND L Doubled bonded : - One pad connected to the left VCO, dividers, mixers and guard ring. the guard connection is star connected directly to the pad. - The second pad is connected to both AGC amps and the deemphasis amplifiers, frequency syn- thesis and FM deviation selection circuit for both channels. A 12V Doubled bonded : - One pad connected to the ESD and guard ring. - The second pad is connected to the main power for all of the audio parts. A GND R Boubled bonded : - One pad connected to the right VCO, dividers, mixers and guard ring. The guard connection is star connected directly to the pad. - The second pad is connected to the bias block, audio noise reduction, volume, mux and ESD. V 12V V GND Video Pads V DD 5V GND 5V Digital Pads 205 Ω A GND L A 12V A GND R Audio Pads + BIP 12V - Substrate DZPN1 DZPN1 DZPN1 BIP 10vpl Vpp Vmm Figure 25 A third bond wire on this pin is connected directly to the die pad (substrate). STV0042A 15/24 |
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