0

4

8

12162024

2832

3640

0

10

20

30

40

50

60

70

80

Rth(j-a) (°C/W)

S(Cu) (cm²)

Fig. 9: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

µm).

12

5

10

100

200

500

1000

I

(A),I²t(A²s)

TSM

Tj initial=25°C

I²t

tp(ms)

Fig. 7: Non repetitive surge peak on-state current

for a sinusoidal pulse with width tp<10ms, and cor-

responding value of I

012345

1

10

100

300

I (A)

TM

Tj=25°C

Tj=Tj max.

Tj max.:

Vto=0.77V

Rt=14m

Ω

V (V)

TM

Fig. 8: On-state characteristics (maximum values).

0

40

80

120

160

200

240

280

320 360

T (°C)

250

200

150

100

50

0

Epoxy FR4

board

Metal-backed

board

245°C

215°C

t (s)

Fig. 10: Typical reflow soldering heat profile, either

for mounting on FR4 or metal-backed boards.

TN2540-G

4/5