ADA4817-2ACPZ-R2 datasheet(5/24 Pages) AD

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ADA4817-1/ADA4817-2

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

PD = Quiescent Power + (Total Drive Power – Load Power)

(1)

Table 3.

Parameter

Rating

Supply Voltage

10.6 V

Power Dissipation

See Figure 3

()

OUT

–

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

(2)

Common-Mode Input Voltage

−VS − 0.5 V to +VS + 0.5 V

Differential Input Voltage

±V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature

(Soldering, 10 sec)

300°C

Junction Temperature

150°C

RMS output voltages should be considered. If RL is referenced

to −VS, as in single-supply operation, the total drive power is

VS × IOUT. If the rms signal levels are indeterminate, consider the

worst-case scenario, when VOUT = VS/4 for RL to midsupply.

() (

)

(3)

In single-supply operation with RL referenced to −VS, worst-

case situation is VOUT = VS/2.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Airflow increases heat dissipation, effectively reducing θJA.

More metal directly in contact with the package leads and

exposed paddle from metal traces, throughholes, ground,

and power planes also reduces θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the exposed paddle

LFCSP_VD (single 94°C/W) and LFCSP_VQ (dual 64°C/W)

package on a JEDEC standard 4-layer board. θJA values are

approximations.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for a device soldered in circuit board for surface-

mount packages.

3.5

–40

AMBIENT TEMPERATURE (°C)

3.0

2.5

2.0

1.5

1.0

0.5

–30 –20 –10 0

10 20 30 40 50 60 70 80 90 100

ADA4817-1

ADA4817-2

Table 4.

Package Type

θJA

θJC

Unit

LFCSP_VD (ADA4817-1)

°C/W

LFSCP_VQ (ADA4817-2)

°C/W

MAXIMUM SAFE POWER DISSIPATION

The maximum safe power dissipation for the ADA4817-1/

ADA4817-2 are limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C (which is

the glass transition temperature), the properties of the plastic

change. Even temporarily exceeding this temperature limit may

change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

ADA4817. Exceeding a junction temperature of 175°C for an

extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature for a

4-Layer Board

ESD CAUTION

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the die

due to the ADA4817-1/ADA4817-2 drive at the output. The

quiescent power is the voltage between the supply pins (VS)

multiplied by the quiescent current (IS).

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