ADA4859-3

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

MAXIMUM POWER DISSIPATION

Table 3.

The maximum power that can be safely dissipated by the

ADA4859-3 is limited by the associated rise in junction

temperature. The maximum safe junction temperature

for plastic encapsulated devices is determined by the glass

transition temperature of the plastic, approximately 150°C.

Temporarily exceeding this limit may cause a shift in parametric

performance due to a change in the stresses exerted on the die

by the package. Exceeding a junction temperature of 175°C for

an extended period can result in device failure.

Parameter

Rating

Supply Voltage

6 V

Internal Power Dissipation1

16-Lead LFCSP

See Figure 2

Input Voltage (Common-Mode)

Differential Input Voltage

Output Short-Circuit Duration

Observe power derating curves

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature

(Soldering, 10 sec)

300°C

To ensure proper operation, it is necessary to observe the

maximum power derating curves in Figure 2.

2.5

2.0

1.5

1.0

0.5

0

–40

–20

0

20

40

60

80

100

AMBIENT TEMPERATURE (°C)

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION