ADA4859-3

Rev. 0 | Page 15 of 16

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

OUTLINE DIMENSIONS

2.25

2.10 SQ

1.95

16

5

13

8

9

12

1

4

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

(BOTTOM VIEW)

12° MAX

1.00

0.85

0.80

0.35

0.30

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

0.25 MIN

SEATING

PLANE

0.25

0.75

0.60

0.50

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 39.16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad (CP-16-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering Quantity

ADA4859-3ACPZ-R21

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

250

ADA4859-3ACPZ-R71

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

1,500

ADA4859-3ACPZ-RL1

–40°C to +105°C

16-Lead LFCSP_VQ

CP-16-4

5,000