TS4872 datasheet(29/29 Pages) STMICROELECTRONICS

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TS4872

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PIN OUT (top view)

MARKING (top view)

PACKAGE MECHANICAL DATA

FLIP CHIP - 8 BUMPS

GND

BYPASS

Vout2

STDBY

Vcc

Vout1

Vin

s Balls are underneath

s Y : Year

s W : Week with two digits

s Example : 1254872

s Die size : (3.02mm±10%) x (1.52mm ±10%)

s Die height (including bumps) : 540µm ±50µm

s Bump height : 140µm ±15µm (i.e. bump diameter of 185µm ±15µm)

s Silicon thickness : 400µm±25µm

s Pitch: 500µm ±10µm and 750µm±10µm

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the

consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from

its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information

previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or

systems without express written approval of STMicroelectronics.

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TS4872 数据表(PDF) 29 Page - STMicroelectronics