SSM2335

Rev. 0 | Page 14 of 1

6

OUTLINE DIMENSIONS

1.490

1.460 SQ

1.430

0.350

0.320

0.290

0.655

0.600

0.545

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

3

B

C

0.270

0.240

0.210

0.385

0.360

0.335

A1 BALL

CORNER

SEATING

PLANE

0.50

BALL PITCH

Figure 34. 9-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-9-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

SSM2335CBZ-R21

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-2

Y1L

SSM2335CBZ-REEL1

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-2

Y1L

SSM2335CBZ-REEL71

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-2

Y1L

EVAL-SSM2335Z1

Evaluation Board