SPC5702BECLU datasheet(2/98 Pages) FREESCALE

2 / 98 page

MPC560xS Microcontroller Data Sheet Data Sheet, Rev. 1

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

Table of Contents

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1

Device Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2

MPC5606S Features. . . . . . . . . . . . . . . . . . . . . . . . . . . .5

1.3

MPC5606S Series Blocks . . . . . . . . . . . . . . . . . . . . . . . .6

1.3.1

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .6

1.3.2

Block Summary . . . . . . . . . . . . . . . . . . . . . . . . . .7

Pinout and Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . .9

2.1

144 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .10

2.2

176 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .11

2.3

208 MAPBGA Package Pinout . . . . . . . . . . . . . . . . . . .11

2.4

Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.4.1

Pad Configuration during Reset Phases . . . . . .13

2.4.2

Voltage Supply Pins. . . . . . . . . . . . . . . . . . . . . .13

2.4.3

Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

2.4.4

System Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . .15

2.4.5

Nexus Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

2.4.6

Functional Ports A, B, C, D, E, F, G, H, I, J, K . .18

2.4.7

Signal Details. . . . . . . . . . . . . . . . . . . . . . . . . . .36

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

3.1

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .39

3.1.1

Recommended Operating Conditions . . . . . . . .41

3.2

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .44

3.2.1

General Notes for Specifications at Maximum

Junction Temperature . . . . . . . . . . . . . . . . . . . .45

3.3

EMI (Electromagnetic Interference) Characteristics . . .47

3.4

Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . .47

3.4.1

Voltage Regulator Electrical Characteristics . . .47

3.4.2

Voltage monitor electrical characteristics. . . . . .48

3.4.3

Low voltage domain power consumption. . . . . .49

3.5

DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .50

3.6

I/O Pad Electrical Characteristics . . . . . . . . . . . . . . . . .50

3.6.1

I/O Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . .50

3.6.2

I/O Input DC Characteristics . . . . . . . . . . . . . . 50

3.6.3

I/O Output DC Characteristics . . . . . . . . . . . . . 51

3.6.4

I/O Pad Current Specification. . . . . . . . . . . . . . 55

3.7

RESET electrical characteristics . . . . . . . . . . . . . . . . . 57

3.8

Main Oscillator Electrical Characteristics . . . . . . . . . . 59

3.9

Low Power Oscillator Electrical Characteristics. . . . . . 61

3.10 FMPLL Electrical Characteristics. . . . . . . . . . . . . . . . . 62

3.11 Main RC Oscillator Electrical Characteristics . . . . . . . 63

3.12 Low Power RC Oscillator Electrical Characteristics . . 64

3.13 Flash Memory Electrical Characteristics . . . . . . . . . . . 64

3.14 Analog to Digital Converter (ADC) Electrical Characteristics

3.14.1 Input Impedance and ADC Accuracy . . . . . . . . 66

3.14.2 ADC Electrical Characteristics . . . . . . . . . . . . . 70

3.15 AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

3.15.1 Pad AC Specifications . . . . . . . . . . . . . . . . . . . 72

3.16 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

3.16.1 IEEE 1149.1 Interface Timing . . . . . . . . . . . . . 74

3.16.2 Nexus Debug Interface. . . . . . . . . . . . . . . . . . . 77

3.16.3 Interface to TFT LCD Panels . . . . . . . . . . . . . . 78

3.16.4 External Interrupt (IRQ) and Non-Maskable

Interrupt (NMI) Timing . . . . . . . . . . . . . . . . . . . 81

3.16.5 Enhanced Modular I/O Subsystem (eMIOS) Timing

3.16.6 FlexCAN Timing . . . . . . . . . . . . . . . . . . . . . . . . 82

3.16.7 Deserial Serial Peripheral Interface (DSPI) . . . 83

3.16.8 I2C Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

3.16.9 Mechanical Outline Drawings. . . . . . . . . . . . . . 89

3.17 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

3.18 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

SPC5702BECLU 数据表(PDF) 2 Page - Freescale Semiconductor, Inc

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