数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

MMBZXVCL 数据表(PDF) 10 Page - NXP Semiconductors

部件名 MMBZXVCL
功能描述  Double ESD protection diodes for transient overvoltage suppression
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

MMBZXVCL 数据表(HTML) 10 Page - NXP Semiconductors

Back Button MMBZXVCL Datasheet HTML 6Page - NXP Semiconductors MMBZXVCL Datasheet HTML 7Page - NXP Semiconductors MMBZXVCL Datasheet HTML 8Page - NXP Semiconductors MMBZXVCL Datasheet HTML 9Page - NXP Semiconductors MMBZXVCL Datasheet HTML 10Page - NXP Semiconductors MMBZXVCL Datasheet HTML 11Page - NXP Semiconductors MMBZXVCL Datasheet HTML 12Page - NXP Semiconductors MMBZXVCL Datasheet HTML 13Page - NXP Semiconductors MMBZXVCL Datasheet HTML 14Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 10 / 15 page
background image
MMBZXVCL_MMBZXVDL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 3 September 2008
10 of 15
NXP Semiconductors
MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
8.
Application information
The MMBZxVCL series and the MMBZxVDL series are designed for the protection of up
to two unidirectional data or signal lines from the damage caused by ESD and surge
pulses. The devices may be used on lines where the signal polarities are either positive or
negative with respect to ground. The devices provide a surge capability of 40 W per line
for a 10/1000
µs waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the devices as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
9.
Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 9.
Typical application: ESD and transient voltage protection of data lines
006aab330
MMBZxVCL/VDL
line 1 to be protected
unidirectional protection
of two lines
bidirectional protection
of one line
line 2 to be protected
GND
MMBZxVCL/VDL
line 1 to be protected
GND



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com