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LTC3524 数据表(PDF) 6 Page - Linear Technology

部件名 LTC3524
功能描述  Adjustable TFT Bias Supply with WLED Driver
PDF  16 Pages
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTC3524 数据表(HTML) 6 Page - Linear Technology

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LTC3524
6
3524f
PIN FUNCTIONS
VIN (Pin 2): Common Input Supply for LCD Bias and White
LED Boost Converters. This pin must be locally bypassed
with a minimum of 2.2μF.
GND/Exposed Pad (Pin 25): Signal and Power Ground for
the LTC3524. Provide a short, direct PCB path between GND
and the (–) side of the boost (VOUT, VLED) filter capaci-
tors, and the (–) side of the charge pump outputs (V2x,
VH, VN) filter capacitors. PCB ground must be soldered
to the Exposed Pad for proper operation.
ELCD (Pin 1): Enable Input for the LTC3524’s LCD Cir-
cuits. LCD bias supplies are actively discharged to GND
when ELCD is low through internal pull down devices. An
optional RC network on ELCD provides a slower ramp-up
of the LCD boost converter inductor current during start-
up (soft-start). Shutdown mode is activated by driving
ELCD, ELED1, and ELED2 low. Shutdown disables all IC
functions and reduces quiescent current from the battery
to less than 2μA.
FBVO (Pin 3): Feedback Pin for the VOUT Switcher. Refer-
ence voltage is 1.225V. Connect resistive divider tap here
with minimum trace area.
V
R
R
See Block Diagram
OUT =+
⎝⎜
⎠⎟
1 225 1
1
2
.(
)
VOUT (Pin 4): Main Output of the LCD Boost Regulator
and Input to the Voltage Doubler (2X) Stage. Bypass
VOUT with a low ESR, ESL ceramic capacitor (X5R type)
between 4.7 and 22μF.
SW1 (Pin 5): Synchronous Boost Switch. Connect a
4.7μH-15μH inductor between SW1 and VIN. Keep PCB
trace lengths as short and wide as possible to reduce EMI
and voltage overshoot. If the inductor current falls to zero,
the PMOS synchronous rectifier is turned off to prevent
reverse charging of the inductor and an internal switch
connects SW1 to VIN to reduce EMI.
C2(Pin 6):
Charge pump doubler flying capacitor negative
node. The charge pump doubler flying capacitor is con-
nected between C2+ and C2. The voltage on C2will alter-
nate between GND and VOUT at an approximate 50% duty
cycle while the charge pump is operating. Use a 0.1μF
X5R type ceramic capacitor for best results.
LCD BIAS PIN FUNCTIONS
C2+ (Pin 7): Charge pump doubler flying capacitor posi-
tive node. The charge pump doubler flying capacitor is
connected between C2+ and C2. The voltage on C2+ will
alternate between VOUT and V2x at an approximate 50%
duty cycle while the charge pump is operating. Use a 0.1μF
X5R type ceramic capacitor for best results.
V2x (Pin 8): Charge Pump Doubler Output and Input to
the Charge Pump Quadrupler. This output generates 2X
VOUT. V2x should be bypassed to GND with a 0.47μF X5R
type ceramic capacitor. C2+ and C2should be left open
and V2x connected to VOUT if the doubler is not needed
to generate VH or VN.
VNIN (Pin 9): Positive Voltage Input for the Charge Pump
Inverter. The charge pump inverter can generate a regu-
lated negative voltage up to the voltage applied to VNIN.
Connect VNIN to VOUT, V2x, or VH. If VNIN is connected
to VH, external diodes and a capacitor are required for
sequencing (see the Applications Information section).
CN+ (Pin 10): Charge Pump Inverter Flying Capacitor
Positive Node. The charge pump inverter flying capacitor
is connected between CN+ and external Schottky diodes
(see Typical Application figures). The voltage on CN+ will
alternate between GND and VNIN at an approximate 50%
duty cycle while the inverting charge pump is operating. Use
a 0.1μF X5R type ceramic capacitor for best results.
NC (PIN 11): No Connect. This pin should be connected
to GND.
VN (Pin 12): Negative Charge Pump Converter Output.
VN can be regulated down to approximately –VNIN volts
depending on where VNIN is connected. VN should be
bypassed to GND with at 0.47μF or larger X5R type ce-
ramic capacitor.



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