Spec i fi c ati on s g iven her ei n m ay be cha nged a t any ti m e w i tho ut pr i or not i ce. Pl eas e c onf ir m te chni c al s pec if i ca ti ons befor e you or der an d/or u se.

PAGE 6 OF 6

7. Dimensions - inches (mm)

8. Chip Quantities Per Reel

0.043±0.002

(1.1±0.1)

0.075±0.002

(1.9±0.1)

0.043±0.002

(1.1±0.1)

0.063±0.002

(1.6±0.1)

0.093±0.002

(2.4±0.1)

0.046±0.002

(1.2±0.1)

0.071±0.002

(1.8±0.1)

0.138±0.002

(3.5±0.1)

0.048±0.002

(1.2±0.1)

0.069±0.004

(1.75±0.10)

0.138±0.002

(3.50±.005)

0.318±0.002

(8.1±0.1)

0.157±0.004

(4.0±0.1)

0.157±0.004

(4.0±0.1)

0.079±0.002

(2.00±0.05)

0.059±0.004

(1.5+0.1/-0.0)

0.039 min.

(1.0 min.)

0.009±0.001

(0.23±0.02)

2B

2A

1J

1J

2A

2B

Tape

Tape

Ao

E

F

W

Po

t

Do

Bo

Ko

Parts on

7 inch (178mm) Reel

Chip Size

1J

2A

2B

3,000

* 2,000/4,000

4,000

Do

E

W

F

Po

Bo

Ko

t

Ao

* MCL0805: 2.7µH ~ 12µH = 2K

0.047µH ~ 2.2µH = 4K

SS-223 R9

9. Recommended PC Board Land Patterns - inches (mm)

1J

0.102 (2.6)

0.118 (3.0)

0.173 (4.4)

0.022 (0.55)

0.026 (0.66)

0.059 (1.5)

0.037 (0.94)

0.057 (1.45)

0.071 (1.8)

2A

2B

Chip Size

L

G

H

G

L

H

10. Recommended Temperature Profiles for Soldering

250°C

150°C

60 Seconds Max.

Preheat 100

Seconds Max.

Soldering

10 Seconds Max.

Natural

Cooling

Recommended Temperature Profile

for Wave Soldering

230°C

150°C

60 Seconds Max.

Preheat 100

Seconds Max.

Soldering

10 Seconds Max.

Natural

Cooling

Recommended Temperature Profile

for Reflow Soldering

20 Seconds Max.

200°C

250°C

150°C

60 Seconds Max.

Preheat 100

Seconds Max.

Soldering

10 Seconds Max.

Natural

Cooling

Recommended Temperature Profile

for Wave Soldering

230°C

150°C

60 Seconds Max.

Preheat 100

Seconds Max.

Soldering

10 Seconds Max.

Natural

Cooling

Recommended Temperature Profile

for Reflow Soldering

20 Seconds Max.

200°C

SS-223 R9

12/6/06

11:26 AM

Page 6