CY74FCT16500T

CY74FCT162500T

2

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature ....................... Com’l

−55°C to +125°C

Ambient Temperature with

Power Applied................................... Com’l

−55°C to +125°C

DC Input Voltage

.................................................−0.5V to +7.0V

DC Output Voltage

..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)

...........................−60 to +120 mA

Power Dissipation .......................................................... 1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Pin Summary

Name

Description

OEAB

A-to-B Output Enable Input

OEBA

B-to-A Output Enable Input (Active LOW)

LEAB

A-to-B Latch Enable Input

LEBA

B-to-A Latch Enable Input

CLKAB

A-to-B Clock Input (Active LOW)

CLKBA

B-to-A Clock Input (Active LOW)

A

A-to-B Data Inputs or B-to-A Three-State Outputs

B

B-to-A Data Inputs or A-to-B Three-State Outputs

Inputs

Outputs

OEAB

LEAB

CLKAB

A

B

L

X

X

X

Z

H

H

X

L

L

H

H

X

H

H

H

L

L

L

H

L

H

H

H

L

H

X

H

L

L

X

Operating Range

Range

Ambient

Temperature

Industrial

−40°C to +85°C

5V

± 10%

Parameter

Description

Test Conditions

Min.

Max.

Unit

Input HIGH Voltage

2.0

V

Input LOW Voltage

0.8

V

100

mV

Input Clamp Diode Voltage

−0.7

−1.2

V

Input HIGH Current

±1

µA

Input LOW Current

±1

µA

High Impedance Output Current

(Three-State Output pins)

±1

µA

High Impedance Output Current

(Three-State Output pins)

±1

µA

−80

−140

−200

mA

−50

−180

mA

Power-Off Disable

[10]

±1

µA

Notes:

1.

H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.

= HIGH-to-LOW Transition.

2.

A-to-B data flow is shown, B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA.

3.

Output level before the indicated steady-state input conditions were established.

4.

Output level before the indicated steady-state input conditions were established, provided that CLKAB was LOW before LEAB went LOW.

5.

Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature

range.

6.

7.

8.

This parameter is specified but not tested.

9.

Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of

a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter

10. Tested at +25˚C.