THMC10SSOPDBQ datasheet(3/20 Pages) TI

3 / 20 page

THMC10

REMOTE/LOCAL TEMPERATURE MONITOR

WITH SMBus INTERFACE

SLIS089 – DECEMBER 1999

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

ADD0

SMBus address select terminal 0 (Note: Excess capacitance on this terminal may cause SMBus address

recognition problems.)

ADD1

SMBus address select terminal 1 (Note: Excess capacitance on this terminal may cause SMBus address

recognition problems.)

ALERT

Active low temperature interrupt signal

DXN

I/O

Current sink for external diode connected transistor and A/D negative input (Do not leave floating if no external

diode is used – should be tied to GND.)

DXP

I/O

Current source for external diode connected transistor and A/D positive input

GND

7, 8

IC ground

N/C

1, 5, 9,

13, 16

N/C

No connection

SCLK

SMBus serial clock input terminal – clock signal for SMBus serial data

SDATA

I/O

SMBus serial data I/O terminal – serial data I/O for SMBus

STBY

Active low standby mode input

VDD

IC supply voltage – should be decoupled with external 0.1

µF capacitor

absolute maximum ratings over operating case temperature (see Note 1) (unless otherwise noted)†

Input voltage on:

VDD supply terminal, V(DDIN)

–0.3 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I/O terminals, V(IOIN)

–0.3 V to VDD + 0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SMBus terminals, V(SMBIN)

–0.3 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DXN terminal, V(DXN)

–0.3 V to 0.8 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SMBus input/output current, I(SMBIN)

–1 mA to 50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DXN input current, I(DXN)

–1 mA to 1 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous power dissipation, PD

330 mW

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating case temperature range, TC

–55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg

–65

°C to 165°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Junction temperature, TJ

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (soldering, 10 sec), T(LEAD)

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values are with respect to GND.

recommended operating conditions

MIN

MAX

UNITS

Supply voltage, VDD

3.6

SMBus input high voltage, VIH

2.2

SMBus input low voltage, VIL

0.8

SMBus operating frequency, f(SCLK)

100

kHz

Operating ambient temperature, TA

°C

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