TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999

4

POST OFFICE BOX 655303

TL061Y chip information

This chip, when properly assembled, has characteristics similar to the TL061. Thermal compression or

ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with

conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

+

–

OUT

IN+

IN–

VCC+

(7)

(3)

(2)

(6)

(4)

VCC–

(1)

(5)

OFFSET N1

OFFSET N2

Chip Thickness: 15 Mils Typical

Bonding Pads: 4

× 4 Mils Minimum

TJ(max) = 150°C

Tolerances Are

±10%.

All Dimensions Are in Mils.

Pin (4) is Internally Connected

to Backside of Chip.

41

53

(6)

(7)

(8)

(1)

(2)

(3)

(4)

(5)