TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999

2

POST OFFICE BOX 655303

NC

2OUT

NC

2IN–

NC

32

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

NC

NC

OUT

NC

NC

IN–

NC

IN+

NC

TL061 ...FK PACKAGE

(TOP VIEW)

32

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

4IN+

NC

NC

3IN+

1IN+

NC

NC

2IN+

3

2

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

NC

1IN–

NC

1IN+

NC

TL062 . . . FK PACKAGE

(TOP VIEW)

TL064 . . . FK PACKAGE

(TOP VIEW)

NC – No internal connection

AVAILABLE OPTIONS

PACKAGED DEVICES

TA

VIOMAX

AT 25

°C

SMALL

OUTLINE

(D008)†

SMALL

OUTLINE

(D014)†

PLASTIC

DIP

(N)

PLASTIC

DIP

(P)

TSSOP

(PW)

CHIP FORM

(Y)

15 mV

TL061CD

TL061CP

TL061CPW

TL061Y

15 mV

6 mV

TL061CD

TL061ACD

TL061CP

TL061ACP

TL061CPW

TL061Y

3 mV

TL061BCD

TL061BCP

0

°C

15 mV

TL062CD

TL062CP

TL062CPW

TL062Y

to

15 mV

6 mV

TL062CD

TL062ACD

TL062CP

TL062ACP

TL062CPW

TL062Y

70

°C

3 mV

TL062BCD

TL062BCP

15 mV

TL064CD

TL064CN

TL064CPW

TL064Y

6 mV

TL064ACD

TL064ACN

3 mV

TL064BCD

TL064BCN

PACKAGE

TA

VIOMAX

AT 25

°C

SMALL

OUTLINE

(D008)†

SMALL

OUTLINE

(D014)†

CHIP

CARRIER

(FK)

CERAMIC

DIP

(J)

CERAMIC

DIP

(JG)

PLASTIC

DIP

(N)

PLASTIC

DIP

(P)

FLAT

PACK

(U)

FLAT

PACK

(W)

–40

°C

TL061ID

TL061IP

40 C

to

6 mV

TL061ID

TL062ID

TL064ID

TL064IN

TL061IP

TL062IP

85

°C

TL062ID

TL062IP

–55

°C

6 mV

TL061MFK

TL061MJG

TL061MU

to

6 mV

TL062MFK

TL062MJG

TL062MU

125

°C

9 mV

TL064MFK

TL064MJ

TL064MW

† The D package is available taped and reeled. Add the suffix R to the device type (e.g., TL061CDR).